Moko Technology Ltd. founded in 2006, Based in Shenzhen, is an expert at embedded engineering, PCB design, manufacturing and assembly. We are honored as the excellent supplier of many companies all over the world. Our company provides full or partial turnkey PCB assembly service ranging from printed circuit board fabrication, components sourcing, PCB assembly to functional testing, enclosure assembly.

Check Full Introduction

MOKO provides 2-50 layer PCBs for fabrication, including HDI, Rigid, Rigid-Flex, & flex boards. From low quantity to mass production, with high quality, and quick turn available at a low cost. As one of the leading PCB manufacturers in China, we adhere strictly to manufacturing rules to maintain quality control.

Our factory was updated with high-quality equipment. Our core machines were all bought from mainstream manufacturers. The core equipment, quality system, personnel management are in line with first-class PCB factories.

PCB Fabrication Equipment

PCB Fabrication Equipment

Etching line

Etching line

Automatic Optical Inspection line

Automatic Optical
Inspection line

CNC Drilling Machine line

CNC Drilling Machine line

Copper sink line

Copper sink line

Electroplating production line

Electroplating production line

Exposure Machine Line

Exposure Machine Line

Forming Machine

Foaming Machine

Fully automatic inspection machine

Fully automatic
inspection machine

PCB Manufacture Capabilities

PCB Manufacture Capabilities

PCB Manufacture Capability: 10,000 square meters PCB per day, a 400,000 pcs monthly

ISO9001, ISO1004, UL listed, RoHS

Nomal PCB board / HDI PCB board / FPC PCB board / rigid-flex PCB board / metal PCB board

Board thickness(mm): 0.3~12

Max. layer-up(L): 50

Check Detailed PCB Fabrication Capability
PCB Fabrication Capability
Ne Položka PCB Process Capability
1 base material Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc.
2 Solder mask color green, red, blue, white, yellow, purple, black
3 Legend color white, yellow, black, red
4 Surface treatment type ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5 Max. layer-up(L) 50
6 Max. unit size (mm) 620*813 (24″*32″)
7 Max. working panel size (mm) 620*900 (24″x35.4″)
8 Max. board thickness (mm) 12
9 Min. board thickness(mm) 0.3
10 Board thickness tolerance (mm) T<1.0 mm: +/-0.10mm ;T>=1.00mm: +/-10%
11 Registration tolerance (mm) +/-0.10
12 Min. mechanical drilling hole diameter (mm) 0.15
13 Min. laser drilling hole diameter(mm) 0.075
14 Max. aspect(through hole) 15:1
Max. aspect(micro-via) 1.3:1
15 Min. hole edge to copper space(mm) L≤10, 0.15; L=12-22, 0.175; L=24-34, 0.2; L=36-44, 0.25; L>=44, 0.3
16 Min. Inner layer clearance(mm) 0.15
17 Min. hole edge to hole edge space(mm) 0.28
18 Min. hole edge to profile line space(mm) 0.2
19 Min. Inner layer copper to profile line space (mm) 0.2
20 Registration tolerance between holes (mm) ±0.05
21 Max. finished copper thickness(um) Outer Layer: 420(12oz)
Inner Layer: 210(6oz)
22 Min. trace width (mm) 0.075 (3mil)
23 Min. trace space (mm) 0.075 (3mil)
24 Solder mask thickness (um) line corner:>8 (0.3mil)
upon copper: >10 (0.4mil)
25 ENIG golden thickness (um) 0.025-0.125
26 ENIG nickle thickness (um) 3-9
27 Sterling silver thickness (um) 0.15-0.75
28 Min. HAL tin thickness (um) 0.75
29 Immersion tin thickness (um) 0.8-1.2
30 Hard-thick gold plating gold thickness(um) 1.27-2.0
31 golden finger plating gold thickness (um) 0.025-1.51
32 golden finger plating nickle thickness(um) 3-15
33 flash gold plating gold thickness (um) 0,025-0.05
34 flash gold plating nickle thickness(um) 3-15
35 profile size tolerance (mm) ±0.08
36 Max. solder mask plugging hole size (mm) 0.7
37 BGA pad (mm) >=0.25 (HAL or HAL Free: 0.35)
38 V-CUT blade position tolerance (mm) +/-0.10
39 V-CUT position tolerance (mm) +/-0.10
40 Gold finger bevel angle tolerance (o) +/-5
41 Impedance tolerance (%) +/-5%
42 Warpage tolerance (%) 0.75%
43 Min. legend width(mm) 0.1
44 Fire flame class 94PROTI-0
Special for Via in pad boards Resin plugged hole size (min.) (mm) 0.3
Resin plugged hole size (max.) (mm) 0.75
Resin plugged board thickness (min.) (mm) 0.5
Resin plugged board thickness (max.) (mm) 3.5
Resin plugged maximum aspect ratio 8:1
Resin plugged minimum hole to hole space (mm) 0.4
different hole size in one board Ano
Max. panel size (finished) (mm) 880 x580
Max. working panel size (mm) 914 X 602
Max. board thickness (mm) 12
Max. layer-up(L) 40
Aspect 30:1 (Min. hole: 0.4 mm)
Line wide/space (mm) 0.075/ 0.075
Back drill capability Ano
Tolerance of back drill (mm) ±0.05
Tolerance of press fit holes (mm) ±0.05
Surface treatment type OSP, sterling silver, ENIG
Rigid-flex board Hole size (mm) 0.2
Dielectrical thickness (mm) 0.025
Working Panel size (mm) 350 X 500
Line wide/space (mm) 0.075/ 0.075
Stiffener Ano
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) >=14
Surface treatment Všechno
Flex board in mid or outer layer Both
Special for HDI products Laser drilling hole size (mm) 0.075
Max. dielectric thickness (mm) 0.15
Min. dielectric thickness (mm) 0.05
Max. aspect 1.5:1
Bottom Pad size (under micro-via) (mm) Hole size+0.15
Top side Pad size ( on micro-via) (mm) Hole size+0.15
Copper filling or not (yes or no) (mm) Ano
Via in Pad design or not ( yes or no) Ano
Buried hole resin plugged (yes or no) Ano
Min. via size can be copper filled (mm) 0.1
Max. stack times 4

PCB & Enclosure Assembly

PCB & Enclosure Assembly

SMT Assembly capability: 5 high-speed SMT lines from Yamaha and Sony(10 million chips per day-0402, 0201 s 8 million per day)

DIP production capability: 3 DIP lines(1.2 million pcs per day)

3 Production Lines for enclosure assembly(Each line has 15 assemblers and 2 quality control engineers)

SMT production line: 5 SMT production lines, factory area 6000m2

All SMD placements are AOI inspected

High-end equipment: YAMAHA/JT, AOI/SPI/XRAY, atd

As small as 0.4mm pitch, all BGA placements are X-ray inspected

Full BOM material supply: RC / bead / inductor / connector / crystal / diode /transistor, etc in stock

Minimum package: 03015, 0201, 0402

One-stop hardware innovation platform: PCB design, board manufacturing, patch assembly, component supply.

PCB Assembly Workflow

PCB Assembly Workflow

PCB Assembly Workflow

PCB Assembly Equipment

Main Production and Inspection equipment (8 SMT LINE 3DIP LINE)

Full-automatic Screen Printer DSP1008

Yamaha YG200 SMT Equipment

Yamaha YV88-XG SMT Equipment

Yamaha YV100XGP SMT Equipment

SMT Production Line

VCTAB486 AOI Equipment

Production Assembly line

Soldering Production Line

Reflow Soldering: XPM²820

Automatic Wave Soldering WS-4501

Automatic Insertion Machine

X-ray UNI-AX8200

PCB Assembly&Inspection Equipment List

Check Details
ITEM Device Name Modelka Výrobce Qty Remarks
1 Full Automatic Screen Printer DSP-1008 DESEN 8
2 SMT Machine YG200 YAMAHA 5 8 SMT Line
3 SMT Machine YV100XG YAMAHA 3
4 SMT Machine YG100XGP YAMAHA 19
5 SMT Machine YV88 YAMAHA 5
6 Reflow Soldering 8820SM NOUSSTAR 4
7 Reflow Soldering XPM820 Vitronics Soltec 3
8 Reflow Soldering NS-800 II JT 1
9 Solder Paste Inspection REAL-Z5000 REAL 1
10 Automatic Optical Inspection System B486 VCTA 3
11 Automatic Optical Inspection System HV-736 HEXI 5
12 X-Ray AX8200 UNICOMP 1
13 BGA Re-work MS8000-S MSC 1
14 Universal 4*48-pindrive concurrent multiprogramming system Beehive204 ELNEC 3
15 Automatic Plug-In machines XG-3000 SCIENCGO 2
16 Automatic wave soldering system WS-450 JT 1 3 DIP LINE
17 Automatic wave soldering system MS-450 JT 2

Certifikáty

We have gained the certificates like ISO9001:2015, ISO 14001, RoHS, and UL.

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