PCB Fabrication Capability |
Ne |
Položka |
PCB Process Capability |
1 |
base material |
Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc. |
2 |
Solder mask color |
green, red, blue, white, yellow, purple, black |
3 |
Legend color |
white, yellow, black, red |
4 |
Surface treatment type |
ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver |
5 |
Max. layer-up(L) |
50 |
6 |
Max. unit size (mm) |
620*813 (24″*32″) |
7 |
Max. working panel size (mm) |
620*900 (24″x35.4″) |
8 |
Max. board thickness (mm) |
12 |
9 |
Min. board thickness(mm) |
0.3 |
10 |
Board thickness tolerance (mm) |
T<1.0 mm: +/-0.10mm ;T>=1.00mm: +/-10% |
11 |
Registration tolerance (mm) |
+/-0.10 |
12 |
Min. mechanical drilling hole diameter (mm) |
0.15 |
13 |
Min. laser drilling hole diameter(mm) |
0.075 |
14 |
Max. aspect(through hole) |
15:1 |
|
Max. aspect(micro-via) |
1.3:1 |
15 |
Min. hole edge to copper space(mm) |
L≤10, 0.15; L=12-22, 0.175; L=24-34, 0.2; L=36-44, 0.25; L>=44, 0.3 |
16 |
Min. Inner layer clearance(mm) |
0.15 |
17 |
Min. hole edge to hole edge space(mm) |
0.28 |
18 |
Min. hole edge to profile line space(mm) |
0.2 |
19 |
Min. Inner layer copper to profile line space (mm) |
0.2 |
20 |
Registration tolerance between holes (mm) |
±0.05 |
21 |
Max. finished copper thickness(um) |
Outer Layer: 420(12oz)
Inner Layer: 210(6oz) |
22 |
Min. trace width (mm) |
0.075 (3mil) |
23 |
Min. trace space (mm) |
0.075 (3mil) |
24 |
Solder mask thickness (um) |
line corner:>8 (0.3mil)
upon copper: >10 (0.4mil) |
25 |
ENIG golden thickness (um) |
0.025-0.125 |
26 |
ENIG nickle thickness (um) |
3-9 |
27 |
Sterling silver thickness (um) |
0.15-0.75 |
28 |
Min. HAL tin thickness (um) |
0.75 |
29 |
Immersion tin thickness (um) |
0.8-1.2 |
30 |
Hard-thick gold plating gold thickness(um) |
1.27-2.0 |
31 |
golden finger plating gold thickness (um) |
0.025-1.51 |
32 |
golden finger plating nickle thickness(um) |
3-15 |
33 |
flash gold plating gold thickness (um) |
0,025-0.05 |
34 |
flash gold plating nickle thickness(um) |
3-15 |
35 |
profile size tolerance (mm) |
±0.08 |
36 |
Max. solder mask plugging hole size (mm) |
0.7 |
37 |
BGA pad (mm) |
>=0.25 (HAL or HAL Free: 0.35) |
38 |
V-CUT blade position tolerance (mm) |
+/-0.10 |
39 |
V-CUT position tolerance (mm) |
+/-0.10 |
40 |
Gold finger bevel angle tolerance (o) |
+/-5 |
41 |
Impedance tolerance (%) |
+/-5% |
42 |
Warpage tolerance (%) |
0.75% |
43 |
Min. legend width(mm) |
0.1 |
44 |
Fire flame class |
94PROTI-0 |
Special for Via in pad boards |
Resin plugged hole size (min.) (mm) |
0.3 |
Resin plugged hole size (max.) (mm) |
0.75 |
Resin plugged board thickness (min.) (mm) |
0.5 |
Resin plugged board thickness (max.) (mm) |
3.5 |
Resin plugged maximum aspect ratio |
8:1 |
Resin plugged minimum hole to hole space (mm) |
0.4 |
different hole size in one board |
Ano |
|
Max. panel size (finished) (mm) |
880 x580 |
Max. working panel size (mm) |
914 X 602 |
Max. board thickness (mm) |
12 |
Max. layer-up(L) |
40 |
Aspect |
30:1 (Min. hole: 0.4 mm) |
Line wide/space (mm) |
0.075/ 0.075 |
Back drill capability |
Ano |
Tolerance of back drill (mm) |
±0.05 |
Tolerance of press fit holes (mm) |
±0.05 |
Surface treatment type |
OSP, sterling silver, ENIG |
Rigid-flex board |
Hole size (mm) |
0.2 |
Dielectrical thickness (mm) |
0.025 |
Working Panel size (mm) |
350 X 500 |
Line wide/space (mm) |
0.075/ 0.075 |
Stiffener |
Ano |
Flex board layers (L) |
8 (4plys of flex board) |
Rigid board layers (L) |
>=14 |
Surface treatment |
Všechno |
Flex board in mid or outer layer |
Both |
Special for HDI produkty |
Laser drilling hole size (mm) |
0.075 |
Max. dielectric thickness (mm) |
0.15 |
Min. dielectric thickness (mm) |
0.05 |
Max. aspect |
1.5:1 |
Bottom Pad size (under micro-via) (mm) |
Hole size+0.15 |
Top side Pad size ( on micro-via) (mm) |
Hole size+0.15 |
Copper filling or not (yes or no) (mm) |
Ano |
Via in Pad design or not ( yes or no) |
Ano |
Buried hole resin plugged (yes or no) |
Ano |
Min. via size can be copper filled (mm) |
0.1 |
Max. stack times |
4 |