PCB Fabrication Capability |
לא | פריט | PCB Process Capability |
1 | base material | Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc. |
2 | Solder mask color | green, red, blue, white, yellow, purple, black |
3 | Legend color | white, yellow, black, red |
4 | Surface treatment type | ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver |
5 | מקסימום. layer-up(ל) | 50 |
6 | מקסימום. unit size (מ"מ) | 620*813 (24″*32″) |
7 | מקסימום. working panel size (מ"מ) | 620*900 (24″x35.4″) |
8 | מקסימום. board thickness (מ"מ) | 12 |
9 | Min. board thickness(מ"מ) | 0.3 |
10 | Board thickness tolerance (מ"מ) | T<1.0 מ"מ: +/-0.10מ"מ ;T>=1.00mm: +/-10% |
11 | Registration tolerance (מ"מ) | +/-0.10 |
12 | Min. mechanical drilling hole diameter (מ"מ) | 0.15 |
13 | Min. laser drilling hole diameter(מ"מ) | 0.075 |
14 | מקסימום. aspect(through hole) | 15:1 |
| מקסימום. aspect(micro-via) | 1.3:1 |
15 | Min. hole edge to copper space(מ"מ) | L≤10, 0.15; L=12-22, 0.175; L=24-34, 0.2; L=36-44, 0.25; L>=44, 0.3 |
16 | Min. Inner layer clearance(מ"מ) | 0.15 |
17 | Min. hole edge to hole edge space(מ"מ) | 0.28 |
18 | Min. hole edge to profile line space(מ"מ) | 0.2 |
19 | Min. Inner layer copper to profile line space (מ"מ) | 0.2 |
20 | Registration tolerance between holes (מ"מ) | ±0.05 |
21 | מקסימום. finished copper thickness(um) | Outer Layer: 420(12oz)
Inner Layer: 210(6oz) |
22 | Min. trace width (מ"מ) | 0.075 (3mil) |
23 | Min. trace space (מ"מ) | 0.075 (3mil) |
24 | Solder mask thickness (um) | line corner:>8 (0.3mil)
upon copper: >10 (0.4mil) |
25 | ENIG golden thickness (um) | 0.025-0.125 |
26 | ENIG nickle thickness (um) | 3-9 |
27 | Sterling silver thickness (um) | 0.15-0.75 |
28 | Min. HAL tin thickness (um) | 0.75 |
29 | Immersion tin thickness (um) | 0.8-1.2 |
30 | Hard-thick gold plating gold thickness(um) | 1.27-2.0 |
31 | golden finger plating gold thickness (um) | 0.025-1.51 |
32 | golden finger plating nickle thickness(um) | 3-15 |
33 | flash gold plating gold thickness (um) | 0,025-0.05 |
34 | flash gold plating nickle thickness(um) | 3-15 |
35 | profile size tolerance (מ"מ) | ±0.08 |
36 | מקסימום. solder mask plugging hole size (מ"מ) | 0.7 |
37 | BGA pad (מ"מ) | >=0.25 (HAL or HAL Free: 0.35) |
38 | V-CUT blade position tolerance (מ"מ) | +/-0.10 |
39 | V-CUT position tolerance (מ"מ) | +/-0.10 |
40 | Gold finger bevel angle tolerance (o) | +/-5 |
41 | Impedance tolerance (%) | +/-5% |
42 | Warpage tolerance (%) | 0.75% |
43 | Min. legend width(מ"מ) | 0.1 |
44 | Fire flame class | 94V-0 |
Special for Via in pad boards | Resin plugged hole size (min.) (מ"מ) | 0.3 |
Resin plugged hole size (max.) (מ"מ) | 0.75 |
Resin plugged board thickness (min.) (מ"מ) | 0.5 |
Resin plugged board thickness (max.) (מ"מ) | 3.5 |
Resin plugged maximum aspect ratio | 8:1 |
Resin plugged minimum hole to hole space (מ"מ) | 0.4 |
different hole size in one board | כן |
| מקסימום. panel size (finished) (מ"מ) | 880 x580 |
מקסימום. working panel size (מ"מ) | 914 איקס 602 |
מקסימום. board thickness (מ"מ) | 12 |
מקסימום. layer-up(ל) | 40 |
Aspect | 30:1 (Min. hole: 0.4 מ"מ) |
Line wide/space (מ"מ) | 0.075/ 0.075 |
Back drill capability | כן |
Tolerance of back drill (מ"מ) | ±0.05 |
Tolerance of press fit holes (מ"מ) | ±0.05 |
Surface treatment type | OSP, sterling silver, ENIG |
Rigid-flex board | Hole size (מ"מ) | 0.2 |
Dielectrical thickness (מ"מ) | 0.025 |
Working Panel size (מ"מ) | 350 איקס 500 |
Line wide/space (מ"מ) | 0.075/ 0.075 |
Stiffener | כן |
Flex board layers (ל) | 8 (4plys of flex board) |
Rigid board layers (ל) | >=14 |
Surface treatment | את כל |
Flex board in mid or outer layer | Both |
Special for HDI מוצרים | Laser drilling hole size (מ"מ) | 0.075 |
מקסימום. dielectric thickness (מ"מ) | 0.15 |
Min. dielectric thickness (מ"מ) | 0.05 |
מקסימום. aspect | 1.5:1 |
Bottom Pad size (under micro-via) (מ"מ) | Hole size+0.15 |
Top side Pad size ( on micro-via) (מ"מ) | Hole size+0.15 |
Copper filling or not (yes or no) (מ"מ) | כן |
Via in Pad design or not ( yes or no) | כן |
Buried hole resin plugged (yes or no) | כן |
Min. via size can be copper filled (מ"מ) | 0.1 |
מקסימום. stack times | 4 |