טכנולוגיית MOKO

Moko Technology Ltd. founded in 2006, Based in Shenzhen, is an expert at embedded engineering, PCB design, manufacturing and assembly. We are honored as the excellent supplier of many companies all over the world. Our company provides full or partial turnkey PCB assembly service ranging from printed circuit board fabrication, components sourcing, PCB assembly to functional testing, enclosure assembly.

Check Full Introduction

MOKO provides 2-50 layer PCBs for fabrication, including HDI, Rigid, Rigid-Flex, & flex boards. From low quantity to mass production, with high quality, and quick turn available at a low cost. As one of the leading PCB manufacturers in China, we adhere strictly to manufacturing rules to maintain quality control.

Our factory was updated with high-quality equipment. Our core machines were all bought from mainstream manufacturers. The core equipment, quality system, personnel management are in line with first-class PCB factories.

PCB Fabrication Equipment

Etching line

Automatic Optical
Inspection line

CNC Drilling Machine line

Copper sink line

Electroplating production line

Exposure Machine Line

Foaming Machine

Fully automatic
inspection machine

PCB Manufacture Capabilities

PCB Manufacture Capability: 10,000 square meters PCB per day, ו 400,000 pcs monthly

ISO9001, ISO1004, UL listed, RoHS

Nomal PCB board / HDI PCB board / FPC PCB board / rigid-flex PCB board / metal PCB board

Board thickness(מ"מ): 0.3~12

מקסימום. layer-up(ל): 50

Check Detailed PCB Fabrication Capability

PCB Fabrication Capability
לא	פריט	PCB Process Capability
1	base material	Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc.
2	Solder mask color	green, red, blue, white, yellow, purple, black
3	Legend color	white, yellow, black, red
4	Surface treatment type	ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5	מקסימום. layer-up(ל)	50
6	מקסימום. unit size (מ"מ)	620813 (24″32″)
7	מקסימום. working panel size (מ"מ)	620*900 (24″x35.4″)
8	מקסימום. board thickness (מ"מ)	12
9	Min. board thickness(מ"מ)	0.3
10	Board thickness tolerance (מ"מ)	T<1.0 מ"מ: +/-0.10מ"מ ;T>=1.00mm: +/-10%
11	Registration tolerance (מ"מ)	+/-0.10
12	Min. mechanical drilling hole diameter (מ"מ)	0.15
13	Min. laser drilling hole diameter(מ"מ)	0.075
14	מקסימום. aspect(through hole)	15:1
	מקסימום. aspect(micro-via)	1.3:1
15	Min. hole edge to copper space(מ"מ)	L≤10, 0.15; L=12-22, 0.175; L=24-34, 0.2; L=36-44, 0.25; L>=44, 0.3
16	Min. Inner layer clearance(מ"מ)	0.15
17	Min. hole edge to hole edge space(מ"מ)	0.28
18	Min. hole edge to profile line space(מ"מ)	0.2
19	Min. Inner layer copper to profile line space (מ"מ)	0.2
20	Registration tolerance between holes (מ"מ)	±0.05
21	מקסימום. finished copper thickness(um)	Outer Layer: 420(12oz) Inner Layer: 210(6oz)
22	Min. trace width (מ"מ)	0.075 (3mil)
23	Min. trace space (מ"מ)	0.075 (3mil)
24	Solder mask thickness (um)	line corner:>8 (0.3mil) upon copper: >10 (0.4mil)
25	ENIG golden thickness (um)	0.025-0.125
26	ENIG nickle thickness (um)	3-9
27	Sterling silver thickness (um)	0.15-0.75
28	Min. HAL tin thickness (um)	0.75
29	Immersion tin thickness (um)	0.8-1.2
30	Hard-thick gold plating gold thickness(um)	1.27-2.0
31	golden finger plating gold thickness (um)	0.025-1.51
32	golden finger plating nickle thickness(um)	3-15
33	flash gold plating gold thickness (um)	0,025-0.05
34	flash gold plating nickle thickness(um)	3-15
35	profile size tolerance (מ"מ)	±0.08
36	מקסימום. solder mask plugging hole size (מ"מ)	0.7
37	BGA pad (מ"מ)	>=0.25 (HAL or HAL Free: 0.35)
38	V-CUT blade position tolerance (מ"מ)	+/-0.10
39	V-CUT position tolerance (מ"מ)	+/-0.10
40	Gold finger bevel angle tolerance (^o)	+/-5
41	Impedance tolerance (%)	+/-5%
42	Warpage tolerance (%)	0.75%
43	Min. legend width(מ"מ)	0.1
44	Fire flame class	94V-0
Special for Via in pad boards	Resin plugged hole size (min.) (מ"מ)	0.3
	Resin plugged hole size (max.) (מ"מ)	0.75
	Resin plugged board thickness (min.) (מ"מ)	0.5
	Resin plugged board thickness (max.) (מ"מ)	3.5
	Resin plugged maximum aspect ratio	8:1
	Resin plugged minimum hole to hole space (מ"מ)	0.4
	different hole size in one board	כן
	מקסימום. panel size (finished) (מ"מ)	880 x580
	מקסימום. working panel size (מ"מ)	914 איקס 602
	מקסימום. board thickness (מ"מ)	12
	מקסימום. layer-up(ל)	40
	Aspect	30:1 (Min. hole: 0.4 מ"מ)
	Line wide/space (מ"מ)	0.075/ 0.075
	Back drill capability	כן
	Tolerance of back drill (מ"מ)	±0.05
	Tolerance of press fit holes (מ"מ)	±0.05
	Surface treatment type	OSP, sterling silver, ENIG
Rigid-flex board	Hole size (מ"מ)	0.2
	Dielectrical thickness (מ"מ)	0.025
	Working Panel size (מ"מ)	350 איקס 500
	Line wide/space (מ"מ)	0.075/ 0.075
	Stiffener	כן
	Flex board layers (ל)	8 (4plys of flex board)
	Rigid board layers (ל)	>=14
	Surface treatment	את כל
	Flex board in mid or outer layer	Both
Special for HDI מוצרים	Laser drilling hole size (מ"מ)	0.075
	מקסימום. dielectric thickness (מ"מ)	0.15
	Min. dielectric thickness (מ"מ)	0.05
	מקסימום. aspect	1.5:1
	Bottom Pad size (under micro-via) (מ"מ)	Hole size+0.15
	Top side Pad size ( on micro-via) (מ"מ)	Hole size+0.15
	Copper filling or not (yes or no) (מ"מ)	כן
	Via in Pad design or not ( yes or no)	כן
	Buried hole resin plugged (yes or no)	כן
	Min. via size can be copper filled (מ"מ)	0.1
	מקסימום. stack times	4

PCB & Enclosure Assembly

SMT Assembly capability: 5 high-speed SMT lines from Yamaha and Sony(10 מיליון צ'יפס ליום-0402, 0201 עם 8 מיליון ליום)

DIP production capability: 3 קווי מח"ש(1.2 מיליון יח 'ליום)

3 Production Lines for enclosure assembly(Each line has 15 assemblers and 2 quality control engineers)

קו ייצור SMT: 5 קווי ייצור SMT, factory area 6000m2

כל מיקומי ה- SMD נבדקים ב- AOI

ציוד מתקדם: YAMAHA / JT, AOI / SPI / XRAY, וכו

מגרש קטן כמו 0.4 מ"מ, כל מיקומי ה- BGA נבדקים ברנטגן

Full BOM material supply: RC / bead / inductor / connector / crystal / diode /transistor, etc in stock

Minimum package: 03015, 0201, 0402

One-stop hardware innovation platform: PCB design, board manufacturing, patch assembly, component supply.

PCB Assembly Workflow

PCB Assembly Equipment

Main Production and Inspection equipment (8 SMT LINE 3DIP LINE)

Full-automatic Screen Printer DSP1008

Yamaha YG200 SMT Equipment

Yamaha YV88-XG SMT Equipment

Yamaha YV100XGP SMT Equipment

SMT Production Line

VCTAB486 AOI Equipment

Production Assembly line

Soldering Production Line

Reflow Soldering: XPM²820

Automatic Wave Soldering WS-4501

Automatic Insertion Machine

X-ray UNI-AX8200

מכלול PCB&Inspection Equipment List

Check Details

ITEM	שם התקן	דֶגֶם	יַצרָן	Qty	Remarks
1	Full Automatic Screen Printer	DSP-1008	DESEN	8
2	SMT Machine	YG200	YAMAHA	5	8 SMT Line
3	SMT Machine	YV100XG	YAMAHA	3
4	SMT Machine	YG100XGP	YAMAHA	19
5	SMT Machine	YV88	YAMAHA	5
6	Reflow Soldering	8820SM	NOUSSTAR	4
7	Reflow Soldering	XPM820	Vitronics Soltec	3
8	Reflow Soldering	NS-800 II	JT	1
9	Solder Paste Inspection	REAL-Z5000	REAL	1
10	Automatic Optical Inspection System	B486	VCTA	3
11	Automatic Optical Inspection System	HV-736	HEXI	5
12	X-Ray	AX8200	UNICOMP	1
13	BGA Re-work	MS8000-S	MSC	1
14	Universal 4*48-pindrive concurrent multiprogramming system	Beehive204	ELNEC	3
15	Automatic Plug-In machines	XG-3000	SCIENCGO	2
16	Automatic wave soldering system	WS-450	JT	1	3 DIP LINE
17	Automatic wave soldering system	MS-450	JT	2	3 DIP LINE

תעודות

We have gained the certificates like ISO9001:2015, ISO14001, RoHS, and UL.

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