მoko Technology Ltd. founded in 2006, Based in Shenzhen, is an expert at embedded engineering, PCB design, manufacturing and assembly. We are honored as the excellent supplier of many companies all over the world. Our company provides full or partial turnkey PCB assembly service ranging from printed circuit board fabrication, components sourcing, PCB assembly to functional testing, enclosure assembly.
MOKO provides 2-50 layer PCBs for fabrication, including HDI, Rigid, Rigid-Flex, & flex boards. From low quantity to mass production, with high quality, and quick turn available at a low cost. As one of the leading PCB manufacturers in China, we adhere strictly to manufacturing rules to maintain quality control.
Our factory was updated with high-quality equipment. Our core machines were all bought from mainstream manufacturers. The core equipment, quality system, personnel management are in line with first-class PCB factories.
PCB Fabrication Equipment
Etching line
Automatic Optical
Inspection line
CNC Drilling Machine line
Copper sink line
Electroplating production line
Exposure Machine Line
Foaming Machine
Fully automatic
inspection machine
PCB Manufacture Capabilities
PCB Manufacture Capability: 10,000 square meters PCB per day, და 400,000 pcs monthly
ISO9001, ISO1004, UL listed, RoHS
Nomal PCB board / HDI PCB board / FPC PCB board / rigid-flex PCB board / metal PCB board
Board thickness(მმ): 0.3~12
მაქს. layer-up(ლ): 50
| PCB Fabrication Capability | ||
| არა | ნივთი | PCB Process Capability |
| 1 | base material | Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc. |
| 2 | Solder mask color | green, red, blue, white, yellow, purple, black |
| 3 | Legend color | white, yellow, black, red |
| 4 | Surface treatment type | ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver |
| 5 | მაქს. layer-up(ლ) | 50 |
| 6 | მაქს. unit size (მმ) | 620*813 (24″*32″) |
| 7 | მაქს. working panel size (მმ) | 620*900 (24″x35.4″) |
| 8 | მაქს. board thickness (მმ) | 12 |
| 9 | Min. board thickness(მმ) | 0.3 |
| 10 | Board thickness tolerance (მმ) | თ<1.0 მმ: +/-0.10მმ ;T>=1.00mm: +/-10% |
| 11 | Registration tolerance (მმ) | +/-0.10 |
| 12 | Min. mechanical drilling hole diameter (მმ) | 0.15 |
| 13 | Min. laser drilling hole diameter(მმ) | 0.075 |
| 14 | მაქს. aspect(through hole) | 15:1 |
| მაქს. aspect(micro-via) | 1.3:1 | |
| 15 | Min. hole edge to copper space(მმ) | L≤10, 0.15; L=12-22, 0.175; L=24-34, 0.2; L=36-44, 0.25; L>=44, 0.3 |
| 16 | Min. Inner layer clearance(მმ) | 0.15 |
| 17 | Min. hole edge to hole edge space(მმ) | 0.28 |
| 18 | Min. hole edge to profile line space(მმ) | 0.2 |
| 19 | Min. Inner layer copper to profile line space (მმ) | 0.2 |
| 20 | Registration tolerance between holes (მმ) | ±0.05 |
| 21 | მაქს. finished copper thickness(um) | Outer Layer: 420(12oz) Inner Layer: 210(6oz) |
| 22 | Min. trace width (მმ) | 0.075 (3mil) |
| 23 | Min. trace space (მმ) | 0.075 (3mil) |
| 24 | Solder mask thickness (um) | line corner:>8 (0.3mil) upon copper: >10 (0.4mil) |
| 25 | ENIG golden thickness (um) | 0.025-0.125 |
| 26 | ENIG nickle thickness (um) | 3-9 |
| 27 | Sterling silver thickness (um) | 0.15-0.75 |
| 28 | Min. HAL tin thickness (um) | 0.75 |
| 29 | Immersion tin thickness (um) | 0.8-1.2 |
| 30 | Hard-thick gold plating gold thickness(um) | 1.27-2.0 |
| 31 | golden finger plating gold thickness (um) | 0.025-1.51 |
| 32 | golden finger plating nickle thickness(um) | 3-15 |
| 33 | flash gold plating gold thickness (um) | 0,025-0.05 |
| 34 | flash gold plating nickle thickness(um) | 3-15 |
| 35 | profile size tolerance (მმ) | ±0.08 |
| 36 | მაქს. solder mask plugging hole size (მმ) | 0.7 |
| 37 | BGA pad (მმ) | >=0.25 (HAL or HAL Free: 0.35) |
| 38 | V-CUT blade position tolerance (მმ) | +/-0.10 |
| 39 | V-CUT position tolerance (მმ) | +/-0.10 |
| 40 | Gold finger bevel angle tolerance (o) | +/-5 |
| 41 | Impedance tolerance (%) | +/-5% |
| 42 | Warpage tolerance (%) | 0.75% |
| 43 | Min. legend width(მმ) | 0.1 |
| 44 | Fire flame class | 94ვ-0 |
| Special for Via in pad boards | Resin plugged hole size (min.) (მმ) | 0.3 |
| Resin plugged hole size (max.) (მმ) | 0.75 | |
| Resin plugged board thickness (min.) (მმ) | 0.5 | |
| Resin plugged board thickness (max.) (მმ) | 3.5 | |
| Resin plugged maximum aspect ratio | 8:1 | |
| Resin plugged minimum hole to hole space (მმ) | 0.4 | |
| different hole size in one board | დიახ | |
| მაქს. panel size (finished) (მმ) | 880 x580 | |
| მაქს. working panel size (მმ) | 914 x 602 | |
| მაქს. board thickness (მმ) | 12 | |
| მაქს. layer-up(ლ) | 40 | |
| Aspect | 30:1 (Min. hole: 0.4 მმ) | |
| Line wide/space (მმ) | 0.075/ 0.075 | |
| Back drill capability | დიახ | |
| Tolerance of back drill (მმ) | ±0.05 | |
| Tolerance of press fit holes (მმ) | ±0.05 | |
| Surface treatment type | OSP, sterling silver, ENIG | |
| Rigid-flex board | Hole size (მმ) | 0.2 |
| Dielectrical thickness (მმ) | 0.025 | |
| Working Panel size (მმ) | 350 x 500 | |
| Line wide/space (მმ) | 0.075/ 0.075 | |
| Stiffener | დიახ | |
| Flex board layers (ლ) | 8 (4plys of flex board) | |
| Rigid board layers (ლ) | >=14 | |
| Surface treatment | ყველა | |
| Flex board in mid or outer layer | Both | |
| Special for HDI პროდუქტები | Laser drilling hole size (მმ) | 0.075 |
| მაქს. dielectric thickness (მმ) | 0.15 | |
| Min. dielectric thickness (მმ) | 0.05 | |
| მაქს. aspect | 1.5:1 | |
| Bottom Pad size (under micro-via) (მმ) | Hole size+0.15 | |
| Top side Pad size ( on micro-via) (მმ) | Hole size+0.15 | |
| Copper filling or not (yes or no) (მმ) | დიახ | |
| Via in Pad design or not ( yes or no) | დიახ | |
| Buried hole resin plugged (yes or no) | დიახ | |
| Min. via size can be copper filled (მმ) | 0.1 | |
| მაქს. stack times | 4 | |
PCB & Enclosure Assembly
SMT Assembly capability: 5 high-speed SMT lines from Yamaha and Sony(10 მილიონი ჩიპი დღეში-0402, 0201 თან 8 მილიონი დღეში)
DIP production capability: 3 DIP ხაზები(1.2 მილიონი ცალი დღეში)
3 Production Lines for enclosure assembly(Each line has 15 assemblers and 2 quality control engineers)
SMT production line: 5 SMT production lines, factory area 6000m2
All SMD placements are AOI inspected
High-end equipment: YAMAHA/JT, AOI/SPI/XRAY, და ა.შ.
As small as 0.4mm pitch, all BGA placements are X-ray inspected
Full BOM material supply: RC / bead / inductor / კონექტორი / crystal / diode /transistor, etc in stock
Minimum package: 03015, 0201, 0402
One-stop hardware innovation platform: PCB design, board manufacturing, patch assembly, component supply.
PCB Assembly Workflow
PCB Assembly Equipment
Main Production and Inspection equipment (8 SMT LINE 3DIP LINE)
Full-automatic Screen Printer DSP1008
Yamaha YG200 SMT Equipment
Yamaha YV88-XG SMT Equipment
Yamaha YV100XGP SMT Equipment
SMT Production Line
VCTAB486 AOI Equipment
Production Assembly line
Soldering Production Line
Reflow Soldering: XPM²820
Automatic Wave Soldering WS-4501
Automatic Insertion Machine
X-ray UNI-AX8200
PCB ასამბლეა&Inspection Equipment List
| ITEM | Device Name | მოდელი | მწარმოებელი | Qty | Remarks |
| 1 | Full Automatic Screen Printer | DSP-1008 | DESEN | 8 | |
| 2 | SMT Machine | YG200 | YAMAHA | 5 | 8 SMT Line |
| 3 | SMT Machine | YV100XG | YAMAHA | 3 | |
| 4 | SMT Machine | YG100XGP | YAMAHA | 19 | |
| 5 | SMT Machine | YV88 | YAMAHA | 5 | |
| 6 | Reflow Soldering | 8820SM | NOUSSTAR | 4 | |
| 7 | Reflow Soldering | XPM820 | Vitronics Soltec | 3 | |
| 8 | Reflow Soldering | NS-800 II | JT | 1 | |
| 9 | Solder Paste Inspection | REAL-Z5000 | REAL | 1 | |
| 10 | Automatic Optical Inspection System | B486 | VCTA | 3 | |
| 11 | Automatic Optical Inspection System | HV-736 | HEXI | 5 | |
| 12 | X-Ray | AX8200 | UNICOMP | 1 | |
| 13 | BGA Re-work | MS8000-S | MSC | 1 | |
| 14 | Universal 4*48-pindrive concurrent multiprogramming system | Beehive204 | ELNEC | 3 | |
| 15 | Automatic Plug-In machines | XG-3000 | SCIENCGO | 2 | |
| 16 | Automatic wave soldering system | WS-450 | JT | 1 | 3 DIP LINE |
| 17 | Automatic wave soldering system | MS-450 | JT | 2 |
სერთიფიკატები
We have gained the certificates like ISO9001:2015, ISO14001, RoHS, and UL.
