- Iimveliso
- Izisombululo
- Isisombululo seleyibhile emhlophe
- Iteknoloji eninzi
- Iinkonzo
- Izicelo
- Iiprojekthi
- Izixhobo
- Malunga
- Singobani
- Kutheni MOKOSmart
- Nxibelelana
Moko Technology Ltd. yasekwa kwi 2006, Isekelwe eShenzhen, yingcaphephe kubunjineli obuzinzisiweyo, Uyilo lwePCB, ukwenziwa kunye nokudibanisa. Siwonga njengababoneleli abagqwesileyo kwiinkampani ezininzi kwihlabathi liphela. Inkampani yethu ibonelela ngenkonzo yendibano epheleleyo okanye eyinxenye yePCB ukusuka kwibhodi yesekethe eprintiweyo, ukufumana amalungu, Indibano yePCB kuvavanyo olusebenzayo, indibano ebiyelweyo.
Jonga Intshayelelo epheleleyo
ENYE uyabonelela 2-50 Umaleko wePCB zokwenza, kuquka HDI, Uqinile, I-Rigid-Flex, & iibhodi flex. Ukususela kumlinganiselo ophantsi ukuya kwimveliso eninzi, ngomgangatho ophezulu, kunye nokujika ngokukhawuleza okufumanekayo ngexabiso eliphantsi. Njengomnye wabavelisi bePCB abaphambili eTshayina, sithobela ngokungqongqo imithetho yokuvelisa ukugcina ulawulo lomgangatho.
Umzi-mveliso wethu wahlaziywa ngezixhobo ezikumgangatho ophezulu. Oomatshini bethu abaphambili bonke bathengwa kubavelisi abaqhelekileyo. Izixhobo eziphambili, inkqubo yomgangatho, ulawulo lwabasebenzi luhambelana neefektri zePCB zodidi lokuqala.
PCB Fabrication Izixhobo
Etching line
I-Optical ezenzekelayo
Umgca wokuhlola
Umgca weCNC Drilling Machine
Umgca we-Copper sink
Umgca wemveliso we-Electroplating
I-Exposure Machine Line
Umatshini onamagwebu
Ngokuzenzekelayo ngokupheleleyo
umatshini wokuhlola
PCB Manufacture Capabilities
PCB Manufacture Capability: 10,000 square metres PCB ngosuku, kwaye 400,000 iipcs ngenyanga
I-ISO9001, ISO1004, UL idweliswe, RoHS
Nomal PCB ibhodi / HDI PCB ibhodi / FPC PCB ibhodi / ibhodi eqinile-flex PCB / ibhodi PCB metal
Ubukhulu bebhodi(mm): 0.3~12
Ubukhulu. umaleko-phezulu(L): 50
Jonga iNgcaciso ye-PCB yokuFamba
| PCB Fabrication Ukukwazi | ||
| Hayi | Umba | Ubuchule beNkqubo yePCB |
| 1 | imathiriyeli esisiseko | TG FR4 eqhelekileyo, Phezulu TG FR4, PTFE, Rogers, UDkt/Df ophantsi njl. |
| 2 | Umbala wemaski yeSolder | luhlaza, bomvu, luhlaza, mhlophe, lubhelu, mfusa, mnyama |
| 3 | Umbala wentsomi | mhlophe, lubhelu, mnyama, bomvu |
| 4 | Uhlobo lonyango lomphezulu | VUMA, Itoti yokuntywiliselwa, I-HAF, ISIQINGATHA, OSP, igolide ekhanyayo, umnwe wegolide, isilivela ecocisisiwe |
| 5 | Ubukhulu. umaleko-phezulu(L) | 50 |
| 6 | Ubukhulu. ubungakanani beyunithi (mm) | 620*813 (24″*32″) |
| 7 | Ubukhulu. ubungakanani bephaneli yokusebenza (mm) | 620*900 (24″x35.4″) |
| 8 | Ubukhulu. ubukhulu bebhodi (mm) | 12 |
| 9 | Min. ubukhulu bebhodi(mm) | 0.3 |
| 10 | Ukunyamezela ubukhulu bebhodi (mm) | T<1.0 mm: +/-0.10mm ;T>=1.00mm: +/-10% |
| 11 | Ukunyamezela ukubhalisa (mm) | +/-0.10 |
| 12 | Min. mechanical umngxuma yokomba ububanzi (mm) | 0.15 |
| 13 | Min. laser yokomba umngxuma ububanzi(mm) | 0.075 |
| 14 | Ubukhulu. inkalo(ngomngxuma) | 15:1 |
| Ubukhulu. inkalo(micro-nge) | 1.3:1 | |
| 15 | Min. udini lomngxuma kwindawo yobhedu(mm) | L≤10, 0.15; L=12-22, 0.175; L=24-34, 0.2; L=36-44, 0.25; L>=44, 0.3 |
| 16 | Min. Ukucocwa komgangatho wangaphakathi(mm) | 0.15 |
| 17 | Min. umngxuma edge kwisithuba emngxunyeni edge(mm) | 0.28 |
| 18 | Min. udini lomngxuma kwisithuba somgca weprofayili(mm) | 0.2 |
| 19 | Min. Ubhedu lwangaphakathi kwisithuba somgca weprofayili (mm) | 0.2 |
| 20 | Ukunyamezelana kobhaliso phakathi kwemingxuma (mm) | ±0.05 |
| 21 | Ubukhulu. ubungqingqwa bobhedu obugqityiweyo(Nye) | Uluhlu lwangaphandle: 420(12oz) Uluhlu lwangaphakathi: 210(6oz) |
| 22 | Min. umkhondo ububanzi (mm) | 0.075 (3mil) |
| 23 | Min. indawo yokulandelela (mm) | 0.075 (3mil) |
| 24 | Ubukhulu bemaski ye-solder (Nye) | ikona yomgca:>8 (0.3mil) phezu kobhedu: >10 (0.4mil) |
| 25 | ENIG ubukhulu begolide (Nye) | 0.025-0.125 |
| 26 | ENIG ubukhulu be-nickle (Nye) | 3-9 |
| 27 | Ubunzima besilivere yeSterling (Nye) | 0.15-0.75 |
| 28 | Min. Ubukhulu betoti ye-HAL (Nye) | 0.75 |
| 29 | Ukuntywiliselwa ubukhulu betoti (Nye) | 0.8-1.2 |
| 30 | Ubungqingqwa begolide etyatyekwe ngegolide(Nye) | 1.27-2.0 |
| 31 | umnwe wegolide utyabeka ubukhulu begolide (Nye) | 0.025-1.51 |
| 32 | umnwe wegolide plating ubukhulu nickle(Nye) | 3-15 |
| 33 | ubungqingqwa begolide yokubeka igolide (Nye) | 0,025-0.05 |
| 34 | Ubunzima be-nickle yegolide ekhanyayo(Nye) | 3-15 |
| 35 | ukunyamezela ubungakanani beprofayile (mm) | ±0.08 |
| 36 | Ubukhulu. solder imaski yokuplaga umngxuma ubungakanani (mm) | 0.7 |
| 37 | Iphedi ye-BGA (mm) | >=0.25 (HAL okanye HAL Mahala: 0.35) |
| 38 | V-CUT blade isikhundla ukunyamezelana (mm) | +/-0.10 |
| 39 | V-CUT ukunyamezela isikhundla (mm) | +/-0.10 |
| 40 | Ukunyamezela i-angle yomnwe wegolide (o) | +/-5 |
| 41 | Ukunyamezela kokunyamezela (%) | +/-5% |
| 42 | Ukunyamezela iWarpage (%) | 0.75% |
| 43 | Min. legend ububanzi(mm) | 0.1 |
| 44 | Iklasi yomlilo wedangatye | 94V-0 |
| Ezikhethekileyo ze Nge pad iibhodi | Ubungakanani bomngxuma weresin eplagiwe (imiz.) (mm) | 0.3 |
| Ubungakanani bomngxuma weresin eplagiwe (max.) (mm) | 0.75 | |
| Resin eziplagwe ibhodi ubukhulu (imiz.) (mm) | 0.5 | |
| Resin eziplagwe ibhodi ubukhulu (max.) (mm) | 3.5 | |
| I-resin iplagiwe ubungakanani bomgangatho ophezulu | 8:1 | |
| Intlaka eplage ubuncinane umngxuma kwisithuba umngxuma (mm) | 0.4 | |
| ubungakanani bomngxuma obahlukeneyo kwibhodi enye | Ewe | |
| Ubukhulu. ubungakanani bephaneli (igqitywe tu) (mm) | 880 x580 | |
| Ubukhulu. ubungakanani bephaneli yokusebenza (mm) | 914 x 602 | |
| Ubukhulu. ubukhulu bebhodi (mm) | 12 | |
| Ubukhulu. umaleko-phezulu(L) | 40 | |
| Umba | 30:1 (Min. umngxuma: 0.4 mm) | |
| Ububanzi bomgca/isithuba (mm) | 0.075/ 0.075 | |
| Ikhono lokubhola ngasemva | Ewe | |
| Ukunyamezela kwi-drill back (mm) | ±0.05 | |
| Ukunyamezela imingxuma yokucinezela (mm) | ±0.05 | |
| Uhlobo lonyango lomphezulu | OSP, isilivela ecocisisiwe, VUMA | |
| I-Rigid-flex ibhodi | Ubungakanani bomngxuma (mm) | 0.2 |
| Ubukhulu be-Dielectrical (mm) | 0.025 | |
| Ubungakanani bePaneli esebenzayo (mm) | 350 x 500 | |
| Ububanzi bomgca/isithuba (mm) | 0.075/ 0.075 | |
| Stiffener | Ewe | |
| Flex board layers (L) | 8 (4iiplys zebhodi yeflex) | |
| Iingqimba zebhodi eziqinileyo (L) | >=14 | |
| Unyango lomphezulu | Zonke | |
| Ibhodi Flex phakathi okanye ngaphandle umaleko | Zombini | |
| Ezikhethekileyo ze HDI iimveliso | Ubungakanani bomngxunya weLaser (mm) | 0.075 |
| Ubukhulu. ubukhulu be-dielectric (mm) | 0.15 | |
| Min. ubukhulu be-dielectric (mm) | 0.05 | |
| Ubukhulu. inkalo | 1.5:1 | |
| Ubungakanani bePad esezantsi (phantsi kwe-micro-via) (mm) | Ubungakanani bomngxuma +0,15 | |
| Ubungakanani bePad yecala eliphezulu ( kwi-micro-via) (mm) | Ubungakanani bomngxuma +0,15 | |
| Ukuzaliswa kobhedu okanye akunjalo (hayi okanye ewe) (mm) | Ewe | |
| Ngokuhamba kuyilo lwePad okanye hayi ( hayi okanye ewe) | Ewe | |
| I-resin yomngxuma engcwatywe iplagiwe (hayi okanye ewe) | Ewe | |
| Min. ngesayizi ingagcwaliswa ubhedu (mm) | 0.1 | |
| Ubukhulu. amaxesha emfumba | 4 | |
PCB & INdibano Ebiyelweyo
Isakhono seNdibano ye-SMT: 5 imigca ye-SMT enesantya esiphezulu evela kwi-Yamaha kunye ne-Sony(10 million chips ngosuku-0402, 0201 nge 8 million ngosuku)
Isakhono sokuvelisa i-DIP: 3 Imigca ye-DIP(1.2 iipcs ezizigidi ngosuku)
3 Imigca yeMveliso yokuhlanganisa indawo ebiyelweyo(Umgca ngamnye une 15 abahlanganisi kunye 2 iinjineli zolawulo lomgangatho)
Umgca wemveliso we-SMT: 5 Imigca yemveliso ye-SMT, indawo yomzimveliso 6000m2
Konke ukufakwa kwe-SMD kuhlolwe i-AOI
Izixhobo eziphezulu: YAMAHA/JT, I-AOI/SPI/XRAY, njl
Incinci njenge-0.4mm pitch, zonke zokubekwa BGA zihlolwe X-reyi
Unikezelo olupheleleyo lwezinto ze-BOM: RC / intsimbi / inductor / isinxibelelanisi / ikristale / diode /transistor, njl
Ubuncinci bephakheji: 03015, 0201, 0402
Iqonga elinye lokumisa izinto ezintsha zehardware: Uyilo lwePCB, ukwenziwa kwebhodi, indibano yesiqwenga, unikezelo lwecandelo.
PCB iNdibano Workflow
PCB Izixhobo zeNdibano
Izixhobo eziphambili zeMveliso kunye noHlolo (8 I-SMT LINE 3DIP LINE)
Isishicileli seSkrini esizenzekelayo esipheleleyo se-DSP1008
Yamaha YG200 SMT Equipment
Yamaha YV88-XG SMT Equipment
Yamaha YV100XGP SMT Equipment
I-SMT Production Line
Izixhobo zeVCTAB486 AOI
Umgca weNdibano yeMveliso
I-Soldering Production Line
I-Soldering kwakhona: XPM²820
I-Automatic wave Soldering WS-4501
Umatshini woFakelo oluzenzekelayo
X-reyi UNI-AX8200
INdibano yePCB&Uluhlu lweZixhobo zokuHlola
Jonga Iinkcukacha
| INTO | Igama Lesixhobo | Umzekelo | Umenzi | Qty | Amagqabantshintshi |
| 1 | Isishicileli seSkrini esizenzekelayo esipheleleyo | I-DSP-1008 | UMZOBI | 8 | |
| 2 | Umatshini we-SMT | YG200 | YAMAHA | 5 | 8 Umgca we-SMT |
| 3 | Umatshini we-SMT | YV100XG | YAMAHA | 3 | |
| 4 | Umatshini we-SMT | YG100XGP | YAMAHA | 19 | |
| 5 | Umatshini we-SMT | YV88 | YAMAHA | 5 | |
| 6 | I-Soldering kwakhona | 8820SM | NOUSSTAR | 4 | |
| 7 | I-Soldering kwakhona | XPM820 | Vitronics Soltec | 3 | |
| 8 | I-Soldering kwakhona | NS-800 II | JT | 1 | |
| 9 | Ukuhlolwa kwe-Solder Paste | I-REAL-Z5000 | YOKWENENE | 1 | |
| 10 | Inkqubo yokuHlola okuSebenzayo | B486 | I-VCTA | 3 | |
| 11 | Inkqubo yokuHlola okuSebenzayo | HV-736 | hexyl | 5 | |
| 12 | I-X-Ray | AX8200 | UNICOMP | 1 | |
| 13 | BGA Re-work | MS8000-S | MSC | 1 | |
| 14 | Universal 4*48-pindrive inkqubo yenkqubo ezininzi | Beehive204 | ELNEC | 3 | |
| 15 | Oomatshini bokufaka i-Automatic Plug-In | XG-3000 | I-SCIENCGO | 2 | |
| 16 | Inkqubo ye-automatic wave soldering | WS-450 | JT | 1 | 3 I-DIP LINE |
| 17 | Inkqubo ye-automatic wave soldering | MS-450 | JT | 2 |
Izatifikethi
Sifumene izatifikethi ezifana ne-ISO9001:2015, ISO14001, RoHS, kunye ne-UL.
